SMT设备,回流焊,BGA返修台,点胶机—SMTVIP网上商城
 
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solder VIP1
Name: solder VIP1
Branding: SMTVIP
Unit: pc
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Alloy: Sn96.5Ag3Cu0.5
Size: μm : 25~45
Application: space (500μm)
melting point: 221℃
metal content% : 85.5~86.0
conglutination: 380000~50000cp
life: 6 months
module life: 〉24 hours
printing speed: most 80mm/s

adhere time: 24 hours

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